The 61st JSAP Spring Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 1:15 PM - 6:45 PM E14 (E302)

3:15 PM - 3:30 PM

[18p-E14-9] Study of High-Strength Bonding in Low-Temperature Chip Direct Bonding

○Yun Liu1, Hideki Nagai1, Katsuyuki Utaka1, Yuichi Matsushima2, Takashi Kasahara1, Jun Mizuno3 (Waseda Univ.1, GCSRO Waseda Univ.2, INN Waseda Univ.3)

Keywords:集積,接合技術,bonding technology