The 61st JSAP Spring Meeting, 2014

Presentation information

Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[19p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Mar 19, 2014 1:15 PM - 6:45 PM E14 (E302)

5:45 PM - 6:00 PM

[19p-E14-18] Polish uniformity for Si and SiO2 using a minimal CMP machine

Norio Umeyama1, Kazutaka Shibuya1,2, Yoshio Nakamura1,2, Kouichiro Ichikawa2, Sommawan Khumpuang1,3, Shiro Hara1,3 (MINIMAL1, Fujikoshi Machinery2, AIST3)

Keywords:化学機械研磨,ミニマルファブ