[19p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

[19p-E14-18] Polish uniformity for Si and SiO₂ using a minimal CMP machine

^○Norio Umeyama¹, Kazutaka Shibuya^1,2, Yoshio Nakamura^1,2, Kouichiro Ichikawa², Sommawan Khumpuang^1,3, Shiro Hara^1,3 (MINIMAL¹, Fujikoshi Machinery², AIST³)

Keywords:化学機械研磨,ミニマルファブ