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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[19p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Wed. Mar 19, 2014 1:15 PM - 6:45 PM E14 (E302)

6:15 PM - 6:30 PM

[19p-E14-20] Wafer thinning process with minimal back grinder

^○Suzuki Masaaki¹, Miura Osamu¹, Ito Noriko¹ (DISCO CORPORATION¹)

Keywords:ミニマル,Grinder