The 61st JSAP Spring Meeting, 2014

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Oral presentation

08. Plasma Electronics » 8.4 Plasma etching

[19p-F6-1~18] 8.4 Plasma etching

Wed. Mar 19, 2014 2:00 PM - 7:00 PM F6 (F306)

2:15 PM - 2:30 PM

△ [19p-F6-2] Dry Etching Properties of LaAlSiOx

○Kazuhisa Matsuda1, Toshiyuki Sasaki1, Mitsuhiro Omura1, Hisataka Hayashi1 (Toshiba S&S Co.1)

Keywords:LaAlSiOx,エッチング,プラズマ