The 61st JSAP Spring Meeting, 2014

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Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[20a-E14-1~10] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Mar 20, 2014 9:00 AM - 11:45 AM E14 (E302)

9:15 AM - 9:30 AM

[20a-E14-2] Development of High Quality Electroplating

○Haruo Iwatsu1, Toshiyuki Matsumoto1, Tomohisa Hoshino1 (TOKYO ELECTRON LIMITED1)

Keywords:めっき,TSV