The 61st JSAP Spring Meeting, 2014

Presentation information

Oral presentation

13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[20a-E14-1~10] 13.3 Si Process・Interconnect・MEMS・Integration

Thu. Mar 20, 2014 9:00 AM - 11:45 AM E14 (E302)

10:00 AM - 10:15 AM

[20a-E14-5] Three-Dimensional Investigation of Dopant Diffusion in Polycrystalline Silicon of Trench Gate Structure

Hisashi Takamizawa1, Yasuo Shimizu1, Koji Inoue1, Fumiko Yano1,2, Yasuyoshi Nagai1, Yorinobu Kunimune3, Masao Inoue3, Akio Nishida3, Masahiro Ikeda3 (IMR, Tohoku Univ.1, Tokyo City Univ.2, Renesas Electronics Corp.3)

Keywords:アトムプローブ,多結晶シリコン,不純物分布