The 76th JSAP Autumn Meeting, 2015

Presentation information

Symposium

Symposium » Dielectric Thin Film Technology Beyond Borders: From Si to Non-Si

[14p-4C-1~6] Dielectric Thin Film Technology Beyond Borders: From Si to Non-Si

Mon. Sep 14, 2015 1:30 PM - 4:45 PM 4C (432)

座長:小山 正人(東芝),渡邉 孝信(早大)

3:15 PM - 3:45 PM

[14p-4C-4] Progress and Challenges in SiC MOS Interface toward SiC Power Devices

〇Tsunenobu Kimoto1 (1.Kyoto Univ.)

Keywords:SiC,MOS interface,power device

SiC has received increasing attention as a promising semiconducotr for advanced power devices. Since thermal oxidation of SiC yields SiO2, SiC power MOSFETs are regarded as one of ideal power switching devices for 600-6500 V applications. However, there still exists a high density of interface states and oxide traps near the SiC MOS interface, which severely affect the performance and reliability of SiC power MOSFETs. In this talk, present status and challenges in SiC MOS interface are reviewed.