[12a-P13-1~11] 13.5 Semiconductor devices and related techologies

[12a-P13-11] TSV Reveal Process Using Very Fine Si/Cu Grinding and Metal Contamination Removal

〇Naoya Watanabe¹, Masahiro Aoyagi¹, Daisuke Katagawa², Tsubasa Bandoh³, Takahiko Mitsui³, Eiichi Yamamoto³ (1.AIST, 2.Apprecia Technology, 3.Okamoto Machine Tool Works)

Keywords:3D IC,TSV Reveal,Si/Cu Grinding