The 77th JSAP Autumn Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[14p-P5-1~13] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Wed. Sep 14, 2016 1:30 PM - 3:30 PM P5 (Exhibition Hall)

1:30 PM - 3:30 PM

[14p-P5-1] A Mechanical Noise Analysis Method for CMOS-MEMS Inertial Sensor

Toshifumi Konishi1, Daisuke Yamane2,4, Hiroyuki Ito2,4, Shiro Dosho2,4, Noboru Ishihara2,4, Hiroshi Toshiyoshi3,4, Kazuya Masu2,4, Katsuyuki Machida1,4 (1.NTT-AT, 2.Tokyo Tech., 3.Univ. of Tokyo, 4.JST-CREST)

Keywords:CMOS-MEMS, mechanical noise, multi-physics simulation

This paper describes a mechanical noise analysis method for a capacitive CMOS-MEMS inertial sensor. We propose a mechanical noise model to calculate with a multi-physics simulation on a conventional circuit design environment. Proposed model is embedded into circuit module. Transient and AC noise characteristics of MEMS inertial sensor are analyzed with the proposed model.