The 77th JSAP Autumn Meeting, 2016

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[15p-B10-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Thu. Sep 15, 2016 1:45 PM - 6:30 PM B10 (Exhibition Hall)

Minoru Sasaki(Toyota Tech. Inst.)

3:45 PM - 4:00 PM

[15p-B10-8] A Design of Spring Constant for MEMS Accelerometer by Multi-layer Metal Technology (I)

TERUAKI SAFU1, Toshifumi Konishi1, Daisuke Yamane2,4, Hiroshi Toshiyoshi3,4, Masato Sone2,4, Kazuya Masu2,4, Katsuyuki Machida1,4 (1.NTT-AT, 2.Tokyo Institute of Technology, 3.The Univ. of Tokyo, 4.JST-CREST)

Keywords:MEMS, Accelerometer

We have developed a highly-sensitive MEMS (Microelectromechanical Systems) accelerometer with multi-layer metal technology. In this work, we propose an approach to design spring constant arranged for the accelerometer which has a high-density proof mass. Mechanical characterisics of the proposed springs are experimentally obtained by using the fabricated device.