Kohei NITTA

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Speaker, Author, Co-Author

Sat. Mar 19, 2016 1:45 PM - 6:15 PM S423 (S4)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[19p-S423-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

2:15 PM - 2:30 PM

△ [19p-S423-3] Forming Seed Film by Electroless Plating for Electrophoretic Si Via Filling

〇Kohei NITTA¹, Ryo TAKIGAWA¹, Akihiro IKEDA¹, Mitsuaki KUMAZAWA², Toshiharu HIRAI², Michiro KOMATSU², Tanemasa ASANO¹ (1.Kyushu Univ., 2.JGC C&C)