HITOSHI UTSUNO

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Speaker, Author, Co-Author

Sat. Mar 19, 2016 1:45 PM - 6:15 PM S423 (S4)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[19p-S423-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

3:00 PM - 3:15 PM

[19p-S423-6] Effect of Additives to Neutral Electroless Copper Plating Solution

〇(M1)HITOSHI UTSUNO¹, Osamu Sugiura² (1.Chiba Inst. of Tech., graduate school of eng., 2.Chiba Inst. of Tech., fac. of eng.)