Taisei Harada

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Speaker, Author, Co-Author

Sun. Mar 20, 2016 1:45 PM - 6:45 PM S423 (S4)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[20p-S423-1~19] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

3:15 PM - 3:30 PM

△ [20p-S423-7] Multi-shots ELA of sputtered Si film and TFT with metal source-drain structure

〇Taisei Harada¹, Futa Gakiya¹, Takuya Ashitomi¹, Tatsuya Okada¹, Takashi Noguchi¹, Kanji Noda², Akira Suwa^2,3, Hiroshi Ikenoue³, Tetsuo Okuyama⁴ (1.Univ. of the Ryukyus, 2.GiGAPHOTON Inc., 3.Kyusyu Univ., 4.TOYOBO Co.Ltd)

3:30 PM - 3:45 PM

[20p-S423-8] Realization of p-channel TFT performance with metal source-drain using BLDA aiming for low-cost CMOS

〇Taisei Harada¹, Takuya Ashitomi¹, Tatsuya Okada¹, Takashi Noguchi¹, Nshikata Osamu², Atsushi Oota² (1.Univ. of the Ryukyus, 2.ULVAC Inc.)

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