Naoya Watanabe

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Speaker, Author, Co-Author

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P17 (Gymnasium)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

4:00 PM - 6:00 PM

[21p-P17-12] TSV Reveal Process Using Si/Cu Grinding, Electroless Sn Plating and Alkaline Etching of Silicon

〇Naoya Watanabe¹, Masahiro Aoyagi¹, Tsubasa Bandoh², Takahiko Mitsui², Eiichi Yamamoto² (1.AIST, 2.Okamoto Machine Tool Works)