[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-12] TSV Reveal Process Using Si/Cu Grinding, Electroless Sn Plating and Alkaline Etching of Silicon

〇Naoya Watanabe¹, Masahiro Aoyagi¹, Tsubasa Bandoh², Takahiko Mitsui², Eiichi Yamamoto² (1.AIST, 2.Okamoto Machine Tool Works)

Keywords:3D integration,TSV,Si/Cu Grinding