[19p-S224-1~17] 7.3 Micro/Nano patterning and fabrication

▲ [19p-S224-14] Induced stress during peeling release with various template stiffness in nanoimprint lithography

〇(M2)Florian Chalvin^1,2, Takamitsu Tochino¹, Naoto Nakamura¹, Masaaki Yasuda¹, Hiroaki Kawata¹, Yoshihiko Hirai¹ (1.Osaka Pref. Univ., 2.ENSEA)

Keywords:Nanoimprint lithography,Template stiffness,Peeling release

In order to minimize the defect formation during nanoimprint lithography, comprehensive studies of the releasing process are needed. According to experiments peeling release offers better results than the lift-off method, however while the lift-off method has been the subject of numerous of studies peeling is not very well theoretically characterized. In this study we simulated the releasing of a PDMS mold having imprinted a PAK01 resist using finite element method. We already obtained that kind of results for the silicon/PMMA couple and wanted to see if we would obtain the same tendencies with a softer couple of materials. We extracted the maximum demolding force and the maximum induced stress in the resist in regard to the stiffness of the material.