The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[20a-S423-1~9] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Sun. Mar 20, 2016 9:00 AM - 12:15 PM S423 (S4)

Minoru Sasaki(Toyota Tech. Inst.)

12:00 PM - 12:15 PM

[20a-S423-9] A THz Dynamic Switch with MEMS Metamaterial Method

Zhengli Han1, Takuya Takahashi1, Hiroshi Toshiyoshi1 (1.The Univ. of Tokyo)

Keywords:MEMS metamaterial device,THz dynamic switch,SOI wafer

A terahertz (THz) dynamic switch with polarization dependence is proposed with MEMS metamaterial method. The split ring resonators (SRRs) are located on a silicon-on-insulator (SOI) wafer, where the buried oxide (BOX) is etched to let the silicon layer together with the SRRs work as a shutter to control the incident THz wave propagation. Electrostatic actuation is employed for the shutter operation.