The 63rd JSAP Spring Meeting, 2016

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Poster presentation

3 Optics and Photonics » 3.15 Silicon photonics

[21p-P16-1~12] 3.15 Silicon photonics

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P16 (Gymnasium)

4:00 PM - 6:00 PM

[21p-P16-9] Study of Heterogeneous Bonding of InP Chip on Si Substrate with Polymer Intermediate Layer

〇Hideki Nagai1, Bo Tian1, Yuichi Matsushima2, Hiroshi Ishikawa1, Katsuyuki Utaka1 (1.Waseda Univ., 2.Waseda GCS)

Keywords:heterogeneous integration