[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

△ [21p-P17-21] Mechanical Property Evaluation of Au/Ti Multi-layered Structure

〇Yota Ishizuka^1,2, Sari Yanagida^1,2, Tso-Fu Mark Chang^1,2, Chun-Yi Chen^1,2, Toshihumi Konishi³, Katsuyuki Machida^1,2,3, Hiroshi Toshiyoshi^1,4, Daisuke Yamane^1,2, Kazuya Masu^1,2, Masato Sone^1,2 (1.Tokyo Inst., 2.JST-CREST, 3.NTT AT, 4.Tokyo Univ.)

Keywords:MEMS,electroplating,gpld