[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

△ [21p-P17-25] Mechanical Properties of Gold Electroplating Material for MEMS Device by Micro-Compression Test

〇Masaharu Yoshiba^1,2, Chun-Yi Chen^1,2, Tso-Fu Mark Chang^1,2, Daisuke Yamane^1,2, Katsuyuki Machida^1,2,3, Kazuya Masu^1,2, Masato Sone^1,2 (1.CREST, 2.P and I Lab,Titech, 3.NTTAT)

Keywords:MEMS,Gold Electroplating Material,Micro-compression test

In this study, the mechanical properties of gold materials for MEMS device were evaluated by a micro-compression test. The micro-compression pillars were fabricated by focused ion beam. The gold films in this study have grain size of nano-order and yield stress of more than 600MPa. Considering that bulk gold material has yield stress of about 200MPa, grain refinement strengthening could occur in the films.