[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

△ [21p-P17-24] Mechanical Property of Cu-Ni-Si Alloy Evaluated by Micro-Compression and Micro-Tensile Testing for Application in MEMS

〇(M1)Sari Yanagida^1,2, Akiyoshi Araki¹, Tso-Fu Mark Chang^1,2, Chun-Yi Chen^1,2, Takashi Nagoshi³, Equo Kobayashi¹, Hideki Hosoda¹, Tatsuo Sato¹, Masato Sone^1,2 (1.Tokyo Tech, 2.CREST, 3.AIST)

Keywords:Mcro mechanical testing,Cu-Ni-Si alloy,MEMS