Ryo Takigawa

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Speaker, Author, Co-Author

Thu. Sep 7, 2017 9:30 AM - 11:30 AM PB3 (P)

Poster presentation
| 13 Semiconductors
| 13.5 Semiconductor devices and related technologies

[7a-PB3-1~9] 13.5 Semiconductor devices and related technologies

9:30 AM - 11:30 AM

[7a-PB3-6] Surface activated bonding of LiNbO₃ wafer and SiO₂ wafer with low-temperature heat-treatment

〇Ryo Takigawa¹, Eiji Higurashi^2,3, Tanemasa Asano¹ (1.Kyushu Univ., 2.AIST, 3.The Univ. of Tokyo)