The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6a-C21-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 6, 2017 9:15 AM - 12:15 PM C21 (C21)

Kazuyoshi Ueno(Shibaura Inst. of Tech), Masahide Goto(NHK)

9:30 AM - 9:45 AM

[6a-C21-2] SiC Nanodots Formation by Hot C+ Ion Implantation into Bulk-Si Substrate

Shinji Nakada1, Masaki Yamamoto1, Sho Irie1, Yusuke Omata1, Takashi Aoki1, Toshiyuki Sameshima2, Tomohisa Mizuno1 (1.Kanagawa Univ., 2.Tokyo Univ Agri. Tech.)

Keywords:photonics, quantum confinement effects, ion implantation

(100)バルク Si 基板へのホット C+イオン注入によるSiCドットの形成に 成功した.更に SiC ドットからの PL 発 光のポスト N2 アニール処理依存性につ いて報告する.