The 78th JSAP Autumn Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6a-C21-1~12] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Sep 6, 2017 9:15 AM - 12:15 PM C21 (C21)

Kazuyoshi Ueno(Shibaura Inst. of Tech), Masahide Goto(NHK)

10:45 AM - 11:00 AM

[6a-C21-7] Formation of copper film by high-pressure hydrogen plasma enhanced transport

Hiromasa Ohmi1, Tatuya Hirono1, Yusuke Kubota2, Yoshiki Sirasu1, Hiroaki Kakiuchi1, Kiyoshi Yasutake1 (1.Osaka Univ., 2.Tokyo Electron LTD.)

Keywords:copper, wiring, hydrogen plasma

高圧水素プラズマを用いた銅の輸送成膜について、得られた銅膜の特性等を報告する。