[6p-C21-1~20] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[6p-C21-20] Synergy between Minimal Fab. System and Clean Unit System Platform (CUSP)

〇Akira Ishibashi^1,5,6, Junji Matsuda², Nobutoshi Noguchi³, Tsukio Etoh⁴, Yoshihisa Ohashi⁵, Shiro Hara⁶ (1.RIES, Hokkaido Univ., 2.Hiei Kensetsu, 3.Ishibashi Arch. Assc, 4.Kindai Setsubi Skkei, 5.CsTEC Corp., 6.AIST)

Keywords:CUSP, Minimal Fab. System, Cleanroom

Clean versatile environments having small footprint, low power-consumption, and high cost-performance can be realized with clean unit system platform (CUSP), while development of minimal fab system with the aim of flexible semiconductor production to cope with high-variation and low-volume production is advancing at a rapid pace. Thus, CUSP is of potential interest to assist the minimal fab systems.