[7p-C19-1~10] Challenges for 'multi-scale' processing - dry, wet, or else?...

[7p-C19-2] Interconnect Technologies on Ultra-Scaling and Ultra-3D-Stacking Era

〇Atsunobu Isobayashi¹ (1.Toshiba)

Keywords:semiconductor

Performance of LSI had been enhanced by following Dennard's and Moore's laws, however, the limitation of its continuity has been stated. Interconnect technologies in LSI has shifted its main topics of research and development as well. In this talk, dry and wet processes that had been developed in the past interconnect development are introduced followed by the candidates of them in future interconnect structures.