The 78th JSAP Autumn Meeting, 2017

Presentation information

Poster presentation

6 Thin Films and Surfaces » 6.4 Thin films and New materials

[8a-PA2-1~17] 6.4 Thin films and New materials

Fri. Sep 8, 2017 9:30 AM - 11:30 AM PA2 (P)

9:30 AM - 11:30 AM

[8a-PA2-7] Preparation and characterization of the resistor thin film by ELAMOD

YUKO UZAWA1, Iwao Yamaguchi1, Tomohiko Nakajima1, Muneyasu Suzuki1, Tetsuo Tsuchiya1 (1.AIST)

Keywords:ELAMOD, resistor

Considering the recent global interest in reducing energy consumption, SiC power electronics technology is now ready to enable the step to the next plateau for efficiency standards. In most case, SiC power modules are designed to work at operating temperatures around 250 oC. Therefore, a development high heat resistant new electronic component such as resistor is necessary. For this aim, we have developed the resistor thin film on various substrates by ELAMOD