Taisei Harada

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Speaker, Author, Co-Author

Tue. Mar 14, 2017 9:15 AM - 12:00 PM 304 (304)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14a-304-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

10:00 AM - 10:15 AM

△ [14a-304-4] Poly-Si TFTs with metal source-drain on PI sheet by ELA

〇Taisei Harada¹, Futa Gakiya¹, Yuya Ishiki¹, Tatsuya Okada¹, Takashi Noguchi¹, Kanji Noda², Akira Suwa^2,3, Hiroshi Ikenoue³ (1.Univ. of the Ryukyus, 2.GiGAPHOTON Inc., 3.Dept. of Gigaphoton Next GLP)

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