The 64th JSAP Spring Meeting, 2017

Tatsuya Okada

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Chairperson, etc.

Fri. Mar 17, 2017 9:00 AM - 12:45 PM E206 (E206)

  • Oral presentation
  • | 13 Semiconductors
  • | 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[17a-E206-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Kuniyuki Kakushima(Titech), Tatsuya Okada(Univ. of the Ryukyus)