The 64th JSAP Spring Meeting, 2017

Presentation information

Print

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14a-304-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Mar 14, 2017 9:15 AM - 12:00 PM 304 (304)

Takashi Noguchi(Univ. of the Ryukyus), Seiichiro Higashi(Hiroshima Univ.), Taizoh Sadoh(Kyushu Univ.)

11:45 AM - 12:00 PM

[14a-304-10] Improvement of Transfer Yield of Single-crystalline Silicon Films and Fabrication of Thin-film Transistors and Logic Circuits on Plastic Substrate

〇(M1)Ryutatsu Mizukami1, Shinji Takeshima1, Tomonori Yamashita1, Seiichiro Higashi1 (1.Hiroshima Univ.)

Keywords:transfer technique, flexible electronics, single crystalline silicon thin film transistor