Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Tue. Mar 14, 2017 9:15 AM - 12:00 PM 304 (304)
Takashi Noguchi(Univ. of the Ryukyus), Seiichiro Higashi(Hiroshima Univ.), Taizoh Sadoh(Kyushu Univ.)
△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above
9:15 AM - 9:30 AM
〇Nobuo Sasaki1, Muhammad Arif2, Yukiharu Uraoka2 (1.Sasaki Consulting, 2.NAIST)
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9:30 AM - 9:45 AM
〇(B)Nozomu Tanaka1, Akira Suwa1,2, Daisuke Nakamura1, Taizoh Sadoh1, Hiroshi Ikenoue1,2 (1.Kyushu Univ., 2.Department of Gigaphoton Next GLP, Kyushu Univ.)
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9:45 AM - 10:00 AM
〇Hiroki Tamaru1, Hiroshi Ikenoue2, Seiichiro Higashi1 (1.Graduate School of Advanced Sciences of Matter, Hiroshima Univ., 2.Department of Gigaphoton Next GLP, Kyushu Univ.)
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10:00 AM - 10:15 AM
〇Taisei Harada1, Futa Gakiya1, Yuya Ishiki1, Tatsuya Okada1, Takashi Noguchi1, Kanji Noda2, Akira Suwa2,3, Hiroshi Ikenoue3 (1.Univ. of the Ryukyus, 2.GiGAPHOTON Inc., 3.Dept. of Gigaphoton Next GLP)
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10:15 AM - 10:30 AM
〇Hiroki Ohsawa1, Akito Hara1 (1.Tohoku Gakuin Univ.)
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10:45 AM - 11:00 AM
〇Ryosuke Nakashima1, Hiroaki Hanafusa1, Seiichiro Higashi1 (1.Hiroshima Univ.)
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11:00 AM - 11:15 AM
〇(D)Hiroshi Oka1, Takashi Tomita1, Takuji Hosoi1, Takayoshi Shimura1, Heiji Watanabe1 (1.Osaka Univ.)
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11:15 AM - 11:30 AM
〇Hiroki Utsumi1, Taisei Sasaki1, Shunya Sekiguchi1, Shoya Takeuchi1, Hiroki Ohsawa1, Akito Hara1 (1.Tohoku Gakuin Univ.)
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11:30 AM - 11:45 AM
〇(M1)Hiromu Harada1, Higashi Seiichiro1, Hanafusa Hiroaki1, Shin ryota1 (1.Hiroshima Univ)
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11:45 AM - 12:00 PM
〇(M1)Ryutatsu Mizukami1, Shinji Takeshima1, Tomonori Yamashita1, Seiichiro Higashi1 (1.Hiroshima Univ.)
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