The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.8 Compound and power electron devices and process technology

[14p-315-1~15] 13.8 Compound and power electron devices and process technology

Tue. Mar 14, 2017 1:15 PM - 5:15 PM 315 (315)

Kenji Shiojima(Univ. of Fukui), Kozo Makiyama(Fujitsu Lab.)

4:00 PM - 4:15 PM

[14p-315-11] TCAD Simulation of AlGaN/GaN HFET Drain Avalanche Breakdown

Yasuo Ohno1, Zhong Wang2, Keunsam Lee2, Wonchul Choi2 (1.Laser Systems, 2.Nihon Synopsys)

Keywords:AlGaN/GaN HFET, avalanche breakdown

Drain avalanche breakdown of AlGaN/GaN HFET is simulated using TCAD simulator. Standard structure FET shows S-type negative differential resistance with the peak voltage of around 500V. At high current region, however, the drain voltage decreases down to 200V. The reduction of the drain voltage is caused by the low-resistance path formed by the double injection of electrons and holes. Breakdown voltage can be increased by either the removal of holes by introducing GR centers or, dividing the paths for electrons and holes by p-type region.