[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-11] A Study of Temperature Dependence of Ti/Au microcantilever by Multi-layer Metal Technology

〇Takuma Suzuki^1,2, Tso-Fu Mark Chang^1,2, Chun-Yi Chen^1,2, Toshifumi Konishi³, Katsuyuki Machida^1,2,3, Hiroshi Toshiyoshi^2,4, Daisuke Yamane^1,2, Kazuya Masu^1,2, Masato Sone^1,2 (1.Tokyo Tech, 2.JST-CREST., 3.NTT AT Coap., 4.UTokyo)

Keywords:MEMS, Gold component, Thermal cycle test