[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-10] Mechanical Property Evaluation of NiFeCoGa Shape Memory Alloys Using Micro-compression Specimens

〇Kengo Igawa¹, Sari Yanagida¹, Tso-Fu Mark Chang¹, Chun-Yi Chen¹, Masaki Tahara¹, Tomonari Inamura¹, Hideki Hosoda¹, Volodymyr A. Chernenko², Masato Sone¹ (1.Tokyo Tech., 2.Ikerbasque)

Keywords:MEMS, Shape memory alloy, Micro mechanical test