1:30 PM - 3:30 PM
△ [14p-P3-18] A Study of Module using MEMS Accelerometer by Multi-layer Metal Technology
Keywords:Multi-layer Metal Technology, MEMS, Inertial Sensor
Poster presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Tue. Mar 14, 2017 1:30 PM - 3:30 PM P3 (BP)
1:30 PM - 3:30 PM
Keywords:Multi-layer Metal Technology, MEMS, Inertial Sensor