[14p-P3-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[14p-P3-7] TSV Bottom Cleaning Process for High Yield Formation of Via-Last TSVs

〇Naoya Watanabe¹, Kikuchi Kikuchi², Azusa Yanagisawa², Haruo Shimamoto¹, Katsuya Kikuchi¹, Masahiro Aoyagi¹, Akio Nakamura² (1.AIST, 2.LAPIS Semiconductor)

Keywords:TSV, Via-Last, TSV Bottom Cleaning