1:30 PM - 3:30 PM
[14p-P3-7] TSV Bottom Cleaning Process for High Yield Formation of Via-Last TSVs
Keywords:TSV, Via-Last, TSV Bottom Cleaning
Poster presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Tue. Mar 14, 2017 1:30 PM - 3:30 PM P3 (BP)
1:30 PM - 3:30 PM
Keywords:TSV, Via-Last, TSV Bottom Cleaning