The 64th JSAP Spring Meeting, 2017

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[15a-304-1~10] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Wed. Mar 15, 2017 9:00 AM - 11:30 AM 304 (304)

Minoru Sasaki(Toyota Tech. Inst.)

9:30 AM - 9:45 AM

[15a-304-3] Nanomechanical Structure Fabrication from NEB-22 Resist by FIB/EB Dual-Beam Lithography

Yuki Yuasa1, Etsuo Maeda1, Reo Kometani1 (1.The Univ. of Tokyo)

Keywords:NEMS, lithography

Carbon nano mechanical structure is expected to be applied to NEMS resonator sensor etc. In this research, to create a simple fabrication process of carbon nano mechanical structure, the structure is fabricated from NEB-22 by FIB/EB Dual-Beam Lithography and the fabrication property is analyzed. From this analysis, increase of the filmy thickness with the increase in exposure Dose and that the fabrication of the film structure of the approximately 70nm thickness was possible were confirmed.