Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Wed. Mar 15, 2017 9:00 AM - 11:30 AM 304 (304)
Minoru Sasaki(Toyota Tech. Inst.)
△：Presentation by Applicant for JSAP Young Scientists Presentation Award
▲：English Presentation
▼：Both of Above
No Mark：None of Above
9:00 AM - 9:15 AM
〇(DC)Reijiro Shimura1,2, Phan Trong Tue1,2, Tatsuya Shimoda1,2, Yuzuru Takamura1,2 (1.JAIST, 2.CREST)
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9:15 AM - 9:30 AM
〇Ripak Park1, Masao Nagase1, Yasuhide Ohno1 (1.Tokushima Univ.)
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9:30 AM - 9:45 AM
〇Yuki Yuasa1, Etsuo Maeda1, Reo Kometani1 (1.The Univ. of Tokyo)
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9:45 AM - 10:00 AM
〇Eiichi Kondoh1, Yuta Ogihara1 (1.Univ. Yamanashi)
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10:00 AM - 10:15 AM
〇Yoshiyuki Watanabe1, Mutsuto Katoh1, Toru Yahagi1, Yutaka Murakami1, Yutaka Abe1 (1.Yamagata Res Inst Tech)
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10:15 AM - 10:30 AM
〇(M2)Ryota Setoguchi1, Yoshio Mita1 (1.Univ. of Tokyo)
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10:30 AM - 10:45 AM
Yoshiyuki Okada1, 〇Takuya Okada1, Kentaro Kawai1, Kenta Arima1, Mizuho Morita1 (1.Osaka Univ.)
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10:45 AM - 11:00 AM
〇Shuhei Onishi1, Yongjoon Choi1, Makoto Ishida1, Kazuaki sawada1, Hiromu Ishii1, Katsuyuki Machida2,3, Kazuya Masu3, Yasuhiko Nikaido5, Mitsumasa Saito5, Shinichi Yoshida4 (1.Toyohashi Univ, 2.NTT-AT, 3.Tokyo Inst, 4.Kyushu Univ, 5.Occupation Univ)
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11:00 AM - 11:15 AM
〇(D)Yusaku Maeda1, Kohei Maeda1, Hideki Kobara2, Hirohito Mori2, Hidekuni Takao1 (1.Eng., Kagawa Univ., 2.Med., Kagawa Univ.)
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11:15 AM - 11:30 AM
〇Tomoaki Nakagawa1,3, Yusaku Maeda1,3, Muhammad Zafri1, Hideki Kobara2, Hirohito Mori2,3, Hidekuni Takao1,3 (1.Eng., Kagawa univ., 2.Med., Kagawa univ., 3.JST-CREST)
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