The 64th JSAP Spring Meeting, 2017

Presentation information

Symposium (Oral)

Symposium » Highly reliable metallization technology for long term retention

[15p-304-1~10] Highly reliable metallization technology for long term retention

Wed. Mar 15, 2017 1:15 PM - 6:00 PM 304 (304)

Shinji Yokogawa(UEC), Eiichi Kondoh(U. Yamanashi)

4:30 PM - 5:00 PM

[15p-304-7] Stability and electronic properties of Cu thin films covered by atomic layer materials

Susumu Okada1 (1.Univ. Tsukuba)

Keywords:Atomic layer materials

Based on the quantum mechanical simulations, we studied the electronic structure, transport properties, and structural stability of Cu thin films covered by the atomic layer materials. Our calculations showed that the atomic layered materials do not affect the electronic structure and transport properties of Cu thin films. On the other hand, the atomic layer materials prevent oxidization of the Cu thin films.