The 64th JSAP Spring Meeting, 2017

Presentation information

Symposium (Oral)

Symposium » Highly reliable metallization technology for long term retention

[15p-304-1~10] Highly reliable metallization technology for long term retention

Wed. Mar 15, 2017 1:15 PM - 6:00 PM 304 (304)

Shinji Yokogawa(UEC), Eiichi Kondoh(U. Yamanashi)

5:30 PM - 5:45 PM

[15p-304-9] Investigation of physical properties on ultra thin PVD-Co(W) barrier/liner layer to improve the reliability of ULSI intercconect

〇(PC)Taewoong Kim1, Takeshi Momose1, Akira Matsuo2, Takuya Seino2, Yukihiro Shimogaki1 (1.The Univ. of Tokyo, 2.CANON ANELVA CORPORATION)

Keywords:PVD-Co(W), barrier/liner single layer, reliability of Cu metallization