Jun Utsumi

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Speaker, Author, Co-Author

Wed. Sep 19, 2018 1:45 PM - 5:30 PM 432 (432)

Symposium (Oral)
| Symposium
| Recent Progresses and Developments of Si Integrated Circuit Technologies with 3D Integrations

[19p-432-1~8] Recent Progresses and Developments of Si Integrated Circuit Technologies with 3D Integrations

4:30 PM - 4:45 PM

[19p-432-6] Direct Bonding of SiO₂/Si Wafers at Room Temperature Using Self-Sputtered Bonding Method

〇Jun Utsumi¹ (1.Mitsubishi Heavy Industries Machine Tool Co., Ltd.)