Ryo Yamato

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Speaker, Author, Co-Author

Thu. Sep 20, 2018 1:15 PM - 6:00 PM 234B (234-2)

Oral presentation
| 22 Joint Session M
| 22.1 Joint Session M "Phonon Engineering"

[20p-234B-1~17] 22.1 Joint Session M "Phonon Engineering"

5:30 PM - 5:45 PM

[20p-234B-16] Impact of bonding layer material on the thermal resistance of metal/insulator stack structure

〇(M2)Ryo Yamato¹, Tianzhuo Zhan¹, Motohiro Tomita¹, Mao Xu¹, Hiroki Takezawa¹, Kohei Mesaki¹, Yibin Xu², Takanobu Watanabe¹ (1.Waseda Univ., 2.NIMS)