Fumito Imura

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Speaker, Author, Co-Author

Fri. Sep 21, 2018 1:00 PM - 4:45 PM 233 (233)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[21p-233-1~14] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

2:45 PM - 3:00 PM

[21p-233-8] Die-Bonding Process of Half-Inch Wafer for Uniformizing of Laser-Vias

〇Fumito Imura^1,2, Seiji Iwasaki³, Hiroshi Matsushita³, Michihiro Inoue¹, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL, 3.ISHII TOOL&ENG.)

4:15 PM - 4:30 PM

[21p-233-13] Solder Ball Joints in Half-Inch Sized BGA Package

〇Fumito Imura^1,2, Michihiro Inoue¹, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.AIST, 2.MINIMAL)

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