9:30 AM - 9:45 AM
△ [18a-233-1] Two-step Poly-Si through-silicon via for high-temperature process of bioprobe
Keywords:through-silicon via, poly-Si, bioprobe
Oral presentation
13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology
Tue. Sep 18, 2018 9:30 AM - 12:00 PM 233 (233)
Masato Sone(Tokyo Tech)
9:30 AM - 9:45 AM
Keywords:through-silicon via, poly-Si, bioprobe