The 79th JSAP Autumn Meeting, 2018

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[18p-PB2-1~7] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Tue. Sep 18, 2018 1:30 PM - 3:30 PM PB (Shirotori Hall)

1:30 PM - 3:30 PM

[18p-PB2-5] A Study on High-Resolution 3-Axis Parallel-Plate MEMS Accelerometer with an Au Single Proof-Mass

〇(B)Takashi Ichikawa1, Hirofumi Niijima1, Tatsuya Koga1, Daisuke Yamane1, Toshifumi Konishi2, Teruaki Safu2, Shinichi Iida2, Hiroyuki Ito1, Noboru Ishihara1, Katsuyuki Machida1, Kazuya Masu1 (1.Tokyo Tech, 2.NTT-AT)

Keywords:MEMS, Multi-layer metal technology, high resolution

We have developed the high sensitive tri-axes MEMS accelerometer for human body diagnostics as applications. In order to realize the high performance tri-axes MEMS accelerometer, we investigated the thickness of Au to design a proof mass and a parallel plate electrode structure for the wide detection range. The paper describes the experimental evaluation results from the proposed devices.