The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

6 Thin Films and Surfaces » 6.4 Thin films and New materials

[19a-234B-1~9] 6.4 Thin films and New materials

Wed. Sep 19, 2018 9:15 AM - 11:45 AM 234B (234-2)

Yoshinobu Nakamura(Univ. of Tokyo)

11:15 AM - 11:30 AM

[19a-234B-8] High-rate sputter deposition of tantalum oxide thin films using water vapor as a reactive gas

Yusuke Ito1, Yoshio Abe1, Midori Kawamura1, Kyung Ho Kim1, Takayuki Kiba1 (1.Kitami Inst. Tech.)

Keywords:tantalum oxide, reactive sputtering, proton conductive solid electrolyte

Application of Ta2O5 to proton conductive solid electrolyte is under study, but there is a problem that Ta2O5 thin film prepared by sputtering method has a slow deposition rate. In this study, the application of water-vapor sputtering method was investigated for the purpose of deposition of Ta2O5 thin film at high deposition rates. As a sputtering gas, a mixed gas of Ar and water vapor was used, and water vapor was sprayed directly onto the substrate surface. When the substrate temperature was room temperature, the deposition rate was as slow as 2.5 nm / min however it increased to 50 nm / min at -170 ℃. Based on the above results, it is considered that water-vapor sputtering is promising as a high-rate deposition technology of Ta2O5 thin film.