[20a-233-1~9] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[20a-233-9] Micro rolling process on a silicon wafer surface

〇Kanna Aoki¹, Keita Ishiguro², Masaki Denokami², Yuya Tanahashi², Kentaro Furusawa¹, Norihiko Sekine¹, Tadafumi Adschiri³, Minoru Fujii² (1.NICT, 2.Kobe Univ., 3.Tohoku Univ.)

Keywords:three-dimensional, fine processing, silicon

Although processing technologies for silicon (Si), a basic material for electronic devices, continues to enhance their finesse, there is still no technology that corresponds to bending work of mechanical machinery. In this study, we developed a technique to bend thin Si wafer surfaces into a tube, bowl, hollow sphere by porosifying a silicon wafer surface using anodic oxidation, and performing photolithography patterning, wet etching, and oxidation in water vapor atmosphere. The mechanism of pattern deformation was analyzed from the viewpoint of structural mechanics, and the design guideline for obtaining any three-dimensional structure was established.