The 79th JSAP Autumn Meeting, 2018

Presentation information

Oral presentation

15 Crystal Engineering » 15.6 Group IV Compound Semiconductors (SiC)

[20p-221C-1~15] 15.6 Group IV Compound Semiconductors (SiC)

Thu. Sep 20, 2018 1:45 PM - 6:00 PM 221C (2F_Lounge1)

Shin-Ichiro Kuroki(Hiroshima Univ.), Kazuma Eto(AIST)

3:30 PM - 3:45 PM

[20p-221C-7] High quality and inclusion suppression by switching flow in 3-inch SiC solution growth

Can Zhu1, Tomoki Endo1, Shunta Harada1, Miho Tagawa1, Toru Ujihara1,2 (1.Nagoya Univ., 2.AIST)

Keywords:switching flow, inclusion, TSD density

In the solution growth of SiC, threading dislocations conversion by the macrosteps were observed, and ultra-high-quality crystal were achieved. On the other hand, the development of macrosteps leads to the formation of macroscopic defects such as solvent inclusion, which degrade the crystal quality. Therefore, it is necessary to control the macrostep. In our pervious study, to stabilize step flow over the entire crystal, the switching flow growth method was proposed. In this study, we investigate the effect of switching flow on the TSD conversion and the inclusion suppression in 3-inch SiC growth.